MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Metal adhesives

(Viewing data as-entered. Click here to return)
Master Bond EP30QF Quartz filled, Two Part Epoxy System
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • Very low shrinkage upon curing
  • High degree of dimensional stability
  • Convenient processing; faster setting
  • Meets NASA low outgassing specifications
Product Description: Master Bond EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and potting. There are many options for curing this system. At room temperature, it cures in 1-2 days. Alternatively, at 150- 200°F, it will cure in 1-2 hours. The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. EP30QF has a very forgiving four to one mix ratio by weight. EP30QF is a reliable electrical insulator. With its lower viscosity and superior flow properties, it is useful for potting and encapsulation. The quartz filler confers a higher level of dimensional stability, along with lower shrinkage when compared to most unfilled epoxy systems. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. It resists many commonly used chemicals including fuels, oils, water along with some acids and bases. The service temperature range is -60°F to +250°F. The color of Part A is tan and Part B is a lighter brown. Most notably, EP30QF also has a relatively low coefficient of thermal expansion as well as robust physical strength properties, particularly in the compressive mode. EP30QF is a popular choice for many challenging applications in the optical, fiber-optic, electronic, aerospace, specialty OEM and related industries.

Product Advantages:

  • Convenient mixing: easy to use mix ratio, four to one by weight
  • Versatile cure schedules: ambient temperature cures or fast, elevated temperature cures as required
  • Exceptionally good flow properties
  • Faster setting than most filled systems
  • Higher tensile modulus and compressive strength values
  • Low shrinkage upon curing, highly dimensionally stable, along a with low coefficient of thermal expansion

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesOriginal ValueComments
Viscosity 100 - 4000 cPPart B
 25000 - 40000 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D >= 80
Tensile Strength 6500 - 7500 psi
Tensile Modulus 400000 - 450000 psi
Compressive Strength >= 18000 psi
Adhesive Bond Strength >= 1400 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
Dielectric Constant 4.3
@Frequency 60 Hz
Dielectric Strength 420 V/mil
@Thickness 3.17 mm
Dissipation Factor 0.024
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -60.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 65.6 - 93.3 °C
 24.0 - 48.0 hour
@Temperature 23.9 °C
Working Life 30.0 - 40.0 minAfter mixing, 100 g batch
Shelf Life 6.00 Month
@Temperature <=23.9 °C
in original, unopened containers
 
Descriptive Properties
Cure ScheduleOvernight at 75°Ffollowed by 2-3 hours at 150-200°F
Mixing Ratio4:1 by weightParts A to B

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Master Bond EP45HTQ Quartz Filled Heat Resistant Epoxy
Rogers Arlon Secure™ 48A50B020 0.020" Thermally Conductive Silicone Rubber Adhesive on Fiberglass for Solar Cell Encapsulation
Dymax 4-425 Glass Bonding Adhesive
Dow 733 GLASS & METAL SEALANT
APCM DA 4518U/E-Glass Unidirectional E-Glass Epoxy Prepreg

PMASTM867 / 185460

Metal adhesives

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.