Lord Adhesives CoolTherm™ SC-324 Thermally Conductive Epoxy Encapsulant

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Lord Adhesives CoolTherm™ SC-324 Thermally Conductive Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	LORD CoolTherm™ SC-324 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. Features: exhibits low shrinkage and stress on components as it cures. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials. provides excellent thermal shock resistance. All information provided by Lord.
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Physical Properties	Metric	English	Comments

Specific Gravity	3.20 g/cc	3.20 g/cc	All components
Water Absorption	<= 0.10 %	<= 0.10 %	cured; ASTM D 570-81
Viscosity	30000 cP @Temperature 25.0 °C	30000 cP @Temperature 77.0 °F	mixed
	35000 cP @Temperature 25.0 °C	35000 cP @Temperature 77.0 °F	SC-324 Resin
	35000 cP @Temperature 25.0 °C	35000 cP @Temperature 77.0 °F	SC-324 Hardener

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	<= 10 ppm	<= 10 ppm	cured
Ionic Impurities - K (Potassium)	<= 10 ppm	<= 10 ppm	cured
Ionic Impurities - Cl (Chloride)	<= 10 ppm	<= 10 ppm	cured

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	50	50	cured; ASTM D 2240
Tensile Strength	0.820 MPa @Temperature 25.0 °C	119 psi @Temperature 77.0 °F	cured; ASTM D 412
Elongation at Break	10 %	10 %	ASTM D 412

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.00e+13 ohm-cm @Temperature 25.0 °C	2.00e+13 ohm-cm @Temperature 77.0 °F	cured; ASTM D 257
Dielectric Strength	7.40 kV/mm	188 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	105 µm/m-°C	58.3 µin/in-°F	ASTM D 2240
Thermal Conductivity	4.00 W/m-K	27.8 BTU-in/hr-ft²-°F	Hot Disc Transient Method, cured

Processing Properties	Metric	English	Comments
Working Life	30.0 min @Temperature 25.0 °C	30.0 min @Temperature 77.0 °F	Mixed
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F	each component from date of manufacture

Descriptive Properties
Appearance	Light Pink Liquid		Mixed
	Pink Liquid		SC-324 Resin
	White Liquid		SC-324 Hardener
Extractable Ionic Contaminants	10 ppm max		Ammonium
	10 ppm max		Bromide
	10 ppm max		Sulfate

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