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Chemically Resistant adhesives

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3D Systems LaserForm® AlSi10Mg (A), DIRECT AGING Aluminum Alloy Material
Categories: Metal; 3D Printing/Additive Manufacturing Metal; Nonferrous Metal; Aluminum Alloy

Material Notes: AlSi10Mg fine-tuned for use with ProX® DMP 320 metal printer producing industrial parts with a combination of good mechanical properties and good thermal conductivity. LaserForm AlSi10Mg (A) is formulated and fine-tuned specifically for 3D Systems DMP 320 metal 3D Printers to deliver high part quality and consistent part properties.

AlSi10Mg combines silicon and magnesium as alloying elements, which results in a significant increase in strength and hardness compared to other aluminum alloys. Due to the very rapid melting and solidification during Direct Metal Printing, LaserForm AlSi10Mg (A) in as-printed condition shows fine microstructure and high strengths. In the aerospace and automotive industry, LaserForm AlSi10Mg (A) is used for its light weight. Both innovative approaches to mold design and specific heat exchanger applications make use of the high thermal conductivity of this alloy.

Information provided by 3D Systems

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Physical PropertiesOriginal ValueComments
Density 2.68 g/ccAbsolute theoretical
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 68 - 76ASTM E18
Tensile Strength, Ultimate 370 - 450 MPaVertical direction - Z; ASTM E8M
 390 - 450 MPaHorizontal direction - XY; ASTM E8M
Tensile Strength, Yield 220 - 300 MPaRp0.2%, Vertical direction - Z; ASTM E8M
 250 - 290 MPaRp0.2%, Horizontal direction - XY; ASTM E8M
Elongation at Break 1.0 - 5.0 %Vertical direction - Z; ASTM E8M
 4.0 - 8.0 %Horizontal direction - XY; ASTM E8M
Tensile Modulus 6700 - 7900 MPaYoungs
Charpy Impact 1.00 - 3.00 JNotch; ASTM E23
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.9 µm/m-°C
@Temperature 20.0 - 100 °C
Thermal Conductivity 113 W/m-K
Melting Point 557 - 596 °C
 
Component Elements PropertiesOriginal ValueComments
Aluminum, Al 87.15 - 90.8 %Balance
Copper, Cu <= 0.10 %
Iron, Fe <= 0.55 %
Lead, Pb <= 0.050 %
Magnesium, Mg 0.20 - 0.45 %
Manganese, Mn <= 0.35 %
Nickel, Ni <= 0.050 %
Silicon, Si 9.0 - 11 %
Tin, Sn <= 0.050 %
Titanium, Ti <= 0.15 %
Zinc, Zn <= 0.10 %
 
Descriptive Properties
Surface Roughness7-10µmVertical direction (Z), SAND BLASTED

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PAPPR3123 / 239091

Chemically Resistant adhesives

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