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Chemically Resistant adhesives

Lord Adhesives Circalok™ 6056 Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: LORD Circalok™ 6056 A/B encapsulant is a black, two-component, room temperature curing epoxy encapsulating compound featuring long pot life, convenient mix ratio and good dielectric properties.

All information provided by Lord.

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Physical PropertiesMetricEnglishComments
Density >= 0.954 g/cc>= 0.0345 lb/in³Circalok 6056 B
 >= 1.721 g/cc>= 0.06216 lb/in³Circalok 6056 A
Viscosity  1200 cP
@Temperature 25.0 °C
1200 cP
@Temperature 77.0 °F
6056 Part B
 120000 cP
@Temperature 25.0 °C
120000 cP
@Temperature 77.0 °F
6056 Part A
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6565cured
Tensile Strength 41.4 MPa6000 psicured
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 8.60e+13 ohm-cm8.60e+13 ohm-cmcured
Dielectric Constant 4.7
@Frequency 60.0 Hz,
Temperature 25.0 °C
4.7
@Frequency 60.0 Hz,
Temperature 77.0 °F
Dielectric Strength 15.4 kV/mm390 kV/incured
Dissipation Factor 0.0035
@Frequency 60 Hz,
Temperature 25.0 °C
0.0035
@Frequency 60 Hz,
Temperature 77.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear 50.0 µm/m-°C27.8 µin/in-°Fcured
Thermal Conductivity 0.865 W/m-K6.00 BTU-in/hr-ft²-°Fcured
Maximum Service Temperature, Air 105 °C221 °FRecommended Continual
 135 °C275 °FRecommended Intermittent
 
Processing PropertiesMetricEnglishComments
Cure Time 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
or 2 hours at 60C
Pot Life 30.0 min
@Temperature 25.0 °C
30.0 min
@Temperature 77.0 °F
in 100 g mass
Shelf Life 6.00 Month6.00 Montheach component, from date of manufacture when stored in original, unopened container
 
Descriptive Properties
AppearanceAmber SyrupCircalok 6056 B
 Black SyrupCircalok 6056 A
Mix Ratio100 parts A to 29 parts Bby weight
 2 parts A to 1 part Bby volume

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PLORD9242 / 232598

Chemically Resistant adhesives

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