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Master Bond adhesives

Elantas EN-2521 (Conap) Potting and Encapsulation Adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes:
Polyurethane Potting and Encapsulating Systems
Conathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many specific potting and encapsulating applications such as modules, strain-sensitive components, transformers, and coils. All 2500 series systems exhibit excellent performance when exposed to adverse environments and temperature ranges between -55°C and +130°C.

Cytec (Conap) EN-2521 Potting and Encapsulation Adhesive
U.L. recognized potting compounds. These systems are excellent choices where a device must eventually obtain U.L. approval. These systems have a U.L. Electrical Temperature Index Rating of 120°C. Refer to U.L. Index No. E69804.
  • Passes Thermal Shock Test (10 Cycles, -65°C to 130°C)
  • Non-Nutrient Fungus Resistance (MIL-STD-810B)
  • Mix Ratio: 20/100 (by Weight)

Information provided by Cytec, subsequently acquired by Elantas.

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Physical PropertiesMetricEnglishComments
Density 1.53 g/cc0.0553 lb/in³Cured
Water Absorption 0.19 %0.19 %24 hours
Water Absorption at Saturation 0.0055 %0.0055 %30 Days
Viscosity 4000 cP
@Temperature 25.0 °C
4000 cP
@Temperature 77.0 °F
Linear Mold Shrinkage 0.0071 cm/cm0.0071 in/in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 65 - 7265 - 72
Tensile Strength, Ultimate 11.0 MPa1600 psi
Elongation at Break 40 %40 %
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 1.20e+14 ohm-cm<= 1.20e+14 ohm-cm
Surface Resistance 4.60e+13 ohm4.60e+13 ohm
Dielectric Constant 4.3
@Frequency 1000 Hz
4.3
@Frequency 1000 Hz
Dielectric Strength 25.6 kV/mm
@Thickness 1.59 mm
650 kV/in
@Thickness 0.0625 in
Dissipation Factor 0.045
@Frequency 1000 Hz
0.045
@Frequency 1000 Hz
Arc Resistance >= 120 sec>= 120 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 160 µm/m-°C
@Temperature 20.0 °C
88.9 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.272 W/m-K1.88 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 130 °C266 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  240 min
@Temperature 100 °C
4.00 hour
@Temperature 212 °F
 360 min
@Temperature 60.0 °C
6.00 hour
@Temperature 140 °F
 10080 min
@Temperature 25.0 °C
168.0 hour
@Temperature 77.0 °F
Pot Life 60.0 - 80.0 min
@Temperature 25.0 °C
60.0 - 80.0 min
@Temperature 77.0 °F
1 lbm
 
Descriptive Properties
ColorTan or Black

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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