LINQTAPE™ PIT1SD Series is a high performance, high-temperature resistant, pressure sensitive polyimide tape designed for both permanent and temporary bonding in many high temperature applications. These applications include but are not limited to semiconductor, smartcard, electronic, automotive and general manufacturing industries. LINQTAPE™ PIT1SD Series provides an excellent balance of electrical, mechanical, thermal, and chemical properties over a wide range of temperatures. It can be used in applications that may see temperatures up to 260°C (500°F). LINQTAPE™ PIT1SD Series comes in 33meter (36yard) length rolls of varying widths. The base polyimide film (backing) thickness is 1mil (25.4±2µm) thick and the total thickness including the adhesive layer is approximately 4mi l(100±4µm). Applications: - High adhesion to wide range of substrates
- Ideal for wafer dicing and die cutting
- Temporary bonding of thermocouples for oven profiling
- Bonding of devices prior to solder reflow
- Splicing of Insulation layers
- Masking in high temperature powder applications
- Gold finger masking
- Insulating circuit boards and coils
- Wave solder masking tape
- Insulation wrapping of coils, transformers and capacitors.
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