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Master Bond adhesives

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Cosmic Plastics E487 lass Filled Epoxy Molding Compound, Electrical Grade  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Glass Fiber Filler; Filled/Reinforced Thermoset

Material Notes:

Data provided by the manufacturer.

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Physical PropertiesOriginal ValueComments
Density 1.85 g/cc
Apparent Bulk Density 0.740 g/cc
Water Absorption 0.20 %48 hrs, 50°C
Linear Mold Shrinkage 0.0010 - 0.0040 cm/cmtypical.
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 70
Tensile Strength, Ultimate 83.0 MPa
Flexural Strength 124 MPa
Flexural Modulus 18.0 GPa
Compressive Strength 193 MPa
Izod Impact, Notched 0.320 J/cm
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm
Dielectric Constant 4.6
@Frequency 1e+6 Hz
Wet
 5.2
@Frequency 1000 Hz
Wet
Dielectric Strength 14.0 kV/mmWet, Step by Step
Dissipation Factor 0.0080
@Frequency 1e+6 Hz
Wet
 0.011
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 0.37683 W/m-K
Deflection Temperature at 1.8 MPa (264 psi) >= 230 °C
 
Processing PropertiesOriginal ValueComments
Processing Temperature 150 - 175 °CMolding temperature

**
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