All-purpose, structural dielectric resin. Better thermal and chemical properties than 8109-8, but requires heat cure. Melts at 70-80°C and remains liquid (supercooled) for many hours at RT. Processing: 100/28 pbw; Potlife: 7-10 h/20°C (68°F), 3-5 h/40°C (105°F), 1-2 h/60°C (140°F); mix at RT; cures in: 20 h/60°C (140°F), 30 min/100°C (212°F), 20 min/140°C (285°F), 1 min + 1-3 h/180°C (356°F). Applications: High temperature performance. |