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Master Bond adhesives

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Materion Copper Beryllium Alloy M25 Rod H (TD04) 0.375 to 1.0 in (UNS C17300)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes:

Information provided by Materion.

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Physical PropertiesOriginal ValueComments
Density 0.300 lb/inĀ³
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 88.0 - 102
Hardness, Vickers 175 - 290
Tensile Strength 90.0 - 125 ksi
Tensile Strength, Yield 75.0 - 105 ksi
@Strain 0.200 %
Elongation at Break 8.00 - 30.0 %
@Thickness 50.8 mm
Modulus of Elasticity 19000 ksi
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000910 - 0.0000110 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 103.7 W/m-K

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NBB738d / 323431

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