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Metal adhesives

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Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant
Categories: Polymer; Adhesive; Thermoset; Epoxy
Material Notes: TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.

Information provided by Tra-Con Inc.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.20 g/ccCured
Viscosity 300 cP
@Temperature 25.0 °C		After mixing
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 5.0 ppm
Ionic Impurities - K (Potassium) 5.0 ppm
Ionic Impurities - Cl (Chloride) 100 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 88
Adhesive Bond Strength 3500 psiLap shear, alum to alum, @ 25°C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.00e+14 ohm-cm
Dielectric Strength 700 V/mil
Dissipation Factor 0.026
 
Thermal PropertiesOriginal ValueComments
CTE, linear 67.0 µm/m-°CBelow Tg
 240 µm/m-°CAbove Tg
Thermal Conductivity 0.200 W/m-K
@Temperature 121 °C
Maximum Service Temperature, Air 140 °C
Minimum Service Temperature, Air -20.0 °C
Glass Transition Temp, Tg 100 °CUltimate Tg
 
Processing PropertiesOriginal ValueComments
Cure Time 1443 min3 min @ 130°C + 24 hrs @ 25°C
 1445 min5 min @ 100°C + 24 hrs @ 25°C
 1.00 hour
@Temperature 100 °C
Working Life 6.00 hour
@Temperature 25.0 °C
 
Descriptive Properties
Color Clear, Amber
Thixotropic Index 1
Weight Loss % 1At 300°C

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PTRAC200 / 71128

Metal adhesives




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