| Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen syringe. Advantages & Application Notes: - Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
- Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices and resisting high temperature packaging.
- Down-hole petrochemical fiber optic sensors resisting >200°C field conditions.
- Fiber optic adhesive suggested applications:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.
- Fiber component packaging, adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
- Medical suggested applications:
- Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including stainless steel, diamond, titanium, brass, ceramics, glass and most plastics.
- Certified to USP Class VI Biocompatibility Standards for medical implants; adhesive for catheter devices including stents and guide wires.
- Electronics Assembly suggested applications:
- Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
- Structural grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton, and magnets.
Information Provided by Epoxy Technology |
