Avient Edgetek® PF-1000 Polysulfone

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Avient Edgetek® PF-1000 Polysulfone (discontinued **)
Categories:	Polymer; Thermoplastic; Polysulfone (PSU)
Material Notes:	The Edgetek® Engineering Thermoplastic Compounds portfolio covers a broad range of standard and custom-formulated high performance materials. This portfolio includes high-temperature materials for elevated service temperature environments, high-modulus / structural materials for load-bearing and high-strength applications and flame-retardant products. These compounds are based on select engineering thermoplastic resins that are compounded with reinforcing additives such as carbon fiber, glass fiber and glass beads. Description/Features: PSU (Polysulfone) Unfilled Hi-Temp Applications: Multi-purpose Processing Method: Injection Molding Information provided by PolyOne Corporation
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Physical Properties	Metric	English	Comments

Specific Gravity	1.24 g/cc	1.24 g/cc	ASTM D792
Water Absorption	0.30 % @Thickness 3.17 mm	0.30 % @Thickness 0.125 in	24 hr. Immersion; ASTM D570
Linear Mold Shrinkage	0.0070 - 0.0080 cm/cm	0.0070 - 0.0080 in/in	ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	70.3 MPa	10200 psi	Type 1 - Rigids, Yield, 0.2 in/min; ASTM D638
Elongation at Break	50 - 100 %	50 - 100 %	Type 1 - Rigids, 0.2 in/min; ASTM D638
Tensile Modulus	2.48 GPa	360 ksi	Type 1 - Rigids, 0.2 in/min; ASTM D638
Flexural Strength	96.5 MPa	14000 psi	ASTM D790
Flexural Modulus	2.62 GPa	380 ksi	ASTM D790
Izod Impact, Notched	0.694 J/cm @Thickness 3.17 mm, Temperature 23.0 °C	1.30 ft-lb/in @Thickness 0.125 in, Temperature 73.4 °F	Method A, Injection Molded; ASTM D256

Thermal Properties	Metric	English	Comments
Deflection Temperature at 1.8 MPa (264 psi)	174 °C	345 °F	Unannealed; ASTM D648

Processing Properties	Metric	English	Comments
Melt Temperature	338 - 360 °C	640 - 680 °F	Molding

**
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PH1PO0556a / 43604

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