Dow SiLK™ I 820 Semiconductor Dielectric Resin

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Dow SiLK™ I 820 Semiconductor Dielectric Resin (discontinued **)
Categories:	Polymer
Material Notes:	SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with standard IC processing tools in todays fabrications. SiLK™ I 820 is fluorine-free, thus is compatible with Ti and Ta barrier materials. Information provided by Dow
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Physical Properties	Metric	English	Comments

Moisture Absorption	0.24 %	0.24 %	80% R.H.
Thickness	0.820 microns	0.0323 mil	3000 rpm
	0.720 - 1.02 microns	0.0283 - 0.0402 mil	2000-4000 rpm

Mechanical Properties	Metric	English	Comments
Tensile Strength, Ultimate	89.0 MPa	12900 psi
Tensile Strength, Yield	60.0 MPa	8700 psi
Tensile Modulus	2.45 GPa	355 ksi

Electrical Properties	Metric	English	Comments
Dielectric Constant	2.6 @Frequency 100000 Hz	2.6 @Frequency 100000 Hz
Dielectric Strength	>= 400 kV/mm	>= 10200 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	62.0 µm/m-°C @Temperature 50.0 - 150 °C	34.4 µin/in-°F @Temperature 122 - 302 °F
Thermal Conductivity	0.190 W/m-K	1.32 BTU-in/hr-ft²-°F
	0.230 W/m-K @Temperature 125 °C	1.60 BTU-in/hr-ft²-°F @Temperature 257 °F
Glass Transition Temp, Tg	>= 490 °C	>= 914 °F
Decomposition Temperature	450 °C	842 °F	1% weight loss per hour

Optical Properties	Metric	English	Comments
Refractive Index	1.63	1.63

**
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PDOW1069 / 30273

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