Cure 6 minutes at 130°C or 3 minutes at 150°C. TIGA 905 is a stress-absorbing and electrically conductive, silver-filled epoxy adhesive recommended for solder replacement in microelectronic interconnect applications. This one-part, smooth paste formulation of refined pure silver and epoxy develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic laminates. TIGA 905 is screen printable, and capable of in line surface mount component attach assembly operations. Information provided by Resin Technology Group. |