Hapco DI-PAK™ R-4525/40 Potting and Encapsulating Compound

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Hapco DI-PAK™ R-4525/40 Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK™ R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained. Information provided by Hapco, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.50 g/cc	ASTM D-4669
Viscosity	3000 cP	ASTM D-4878
Linear Mold Shrinkage	0.00050 - 0.0030 in/in	ASTM D-2566

Mechanical Properties	Original Value	Comments
Hardness, Shore D	88	ASTM D-2240
Tensile Strength	6200 psi	ASTM D-638
Elongation at Break	1.5 %	ASTM D-638
Modulus of Elasticity	320 ksi	ASTM D-638
Flexural Strength	7300 psi	ASTM D-790
Flexural Modulus	344 ksi	ASTM D-790
Izod Impact, Notched	0.500 ft-lb/in	ASTM D-256
Izod Impact, Unnotched	0.720 ft-lb/in	ASTM D-256

Electrical Properties	Original Value	Comments
Volume Resistivity	1.10e+14 ohm-cm	ASTM D-270
Dielectric Constant	4.2 @Frequency 100000 Hz	ASTM D-150
	4.3 @Frequency 1000 Hz	ASTM D-150
Dielectric Strength	520 V/mil	ASTM D-149
Dissipation Factor	0.0011 @Frequency 100000 Hz	ASTM D-150

Thermal Properties	Original Value	Comments
Thermal Conductivity	2.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert	110 °C

Processing Properties	Original Value	Comments
Cure Time	24.0 hour @Thickness 3.17 mm	Demold
Gel Time	35.0 - 45.0 min @Load 0.100 kg	ASTM D-2971

Descriptive Properties
Color (cured)	Glossy Black
Mix Ratio	100:20	Weight
	100:33	Volume

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PHAPCO036 / 317095

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