Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive

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Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive
Categories:	Polymer; Adhesive; Thermoset; Polymethacrylimide
Material Notes:	Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400ºC seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.22 g/cc
Particle Size	<= 10 µm
Viscosity	350000 - 550000 cP @Temperature 23.0 °C	0.5 rpm

Chemical Properties	Original Value	Comments
Ionic Impurities - Na (Sodium)	107 ppm
Ionic Impurities - K (Potassium)	2.0 ppm
Ionic Impurities - Cl (Chloride)	50 ppm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Tensile Modulus	1.13e+6 psi	Storage

Thermal Properties	Original Value	Comments
CTE, linear	46.0 µm/m-°C	Below Tg
	139 µm/m-°C	Above Tg
Thermal Conductivity	0.760 W/m-K
Maximum Service Temperature, Air	300 °C	Continuous
	400 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 200 °C	Cure 150ºC/1 hour + 275ºC/1 hours; Ramp 20°C/min to 350ºC
Decomposition Temperature	519 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 150 °C	+ 275°C, Minimum, Pre-Bake
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Black
Consistency	Smooth paste
Die Shear	3.8 kg
Ionic Impurities NH₄	27 ppm
Number of Components	Single
Thixotropic Index	>1.3	between 0.5 & 1 rpm
Weight Loss	0.22%	200°C
	0.23%	250°C
	0.29%	300°C

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PPOXYT102 / 141141

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