Cookson Group STAYSTIK® 783G Alumina Filled "Low Flow" Dielectric Paste

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Cookson Group STAYSTIK® 783G Alumina Filled "Low Flow" Dielectric Paste (discontinued **)
Categories:	Polymer; Adhesive; Thermoplastic
Material Notes:	These thermoplastic adhesive pastes are designed for use in a variety of electronic applications. These materials are characterized by their excellent bonding. These pastes can be used for die, lid seal and/or substrate attach in hybrid, Multi-Chip Modules (MCMs) or other microelectronic packages. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features: Fully polymerized resin No chemical reaction Easily reworkable No outgassing Bonds in seconds Meets Mil-Std requirements Low modulus material Information provided by Cookson Electronics
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Mechanical Properties	Original Value	Comments

Modulus of Elasticity	>= 350 ksi
Adhesive Bond Strength	>= 2500 psi	Die shear adhesion, at 25°C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+9 ohm-cm

Thermal Properties	Original Value	Comments
Thermal Conductivity	<= 0.600 W/m-K
Maximum Service Temperature, Air	150 °C	Continuous use
	<= 300 °C	Excursion Temperature
Minimum Service Temperature, Air	-65.0 °C	Continuous use
Glass Transition Temp, Tg	>= 98.0 °C

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month	at 25°C

Descriptive Properties
Attach Temperature	160-275°C
Filler Material	Alumina

**
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