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Chemically Resistant adhesives

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Rogers Corporation RO4450F Prepreg
Categories: Polymer; Thermoset

Material Notes: Prepreg is commonly used to inexpensively form less critical signal layers in antenna designs. A high post-cure Tg makes RO4400 series prepreg an excellent choice for multi-layers requiring sequential laminations as fully cured RO4400 prepregs are capable of handling multiple lamination cycle.

RO4450F™ prepreg has demonstrated improvement in lateral flow capability.

Information provided by Rogers Corporation.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.83 g/ccASTM D792
Moisture Absorption at Equilibrium 0.090 %
@Temperature 50.0 °C,
Time 173000 sec
Immersion; 0.06 in thick; ASTM D570
Thickness 4.00 mil
 
Mechanical PropertiesOriginal ValueComments
Peel Strength 4.00 pliCopper adhesion; Z direction; 1/2 oz. EDC After Solder Float; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.93e+14 ohm-cm50% RH; IPC 2.5.17.1
Dielectric Constant 3.47 - 3.57
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Dielectric Strength 1000 V/milZ Direction, 50% RH; IPC-TM-650 2.5.6.2
Dissipation Factor 0.0040
@Frequency 1e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature -55.0 - 280 °C
Y Direction; IPC-TM-650 2.4.41
 19.0 µm/m-°C
@Temperature -55.0 - 280 °C
X Direction; IPC-TM-650 2.4.41
 50.0 µm/m-°C
@Temperature -55.0 - 280 °C
Z Direction; IPC-TM-650 2.4.41
Thermal Conductivity 0.650 W/m-K
@Temperature 80.0 °C
Z Direction; ASTM C518
Glass Transition Temp, Tg >= 280 °C10°C/min, TGA; IPC-TM-650 2.4.24
Decomposition Temperature 390 °CTGA; ASTM D3850
Flammability, UL94 V-0

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PROGA957 / 138397

Chemically Resistant adhesives

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