Henkel Loctite® 5920™ RTV Silicone Sealant

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Henkel Loctite® 5920™ RTV Silicone Sealant
Categories:	Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade
Material Notes:	LOCTITE® 5920™ is a moisture-curing, non-corrosive silicone. The thixotropic nature of LOCTITE® 5920™ reduces the migration of liquid product after application to the substrate. It has been designed specially for gasketing and sealing applications where excellent temperature resistance is required. It is also used for electrical insulating applications. This product is suitable for high temperature applications.
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Physical Properties	Original Value	Comments

Density	1.05 g/cc	uncured

Mechanical Properties	Original Value	Comments
Hardness, Shore A	23 - 38	cured 7 days, 25°C; 45-55% RH; ISO 868
Tensile Strength, Ultimate	205 psi	cured 7 days, 25°C; 45-55% RH; ISO 37
Elongation at Break	>= 350 %	cured 7 days, 25°C; 45-55% RH; ISO 37
Adhesive Bond Strength	15.0 psi	Brass; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	15.0 psi	ABS; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	15.0 psi	Silicone; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	35.0 psi	Aluminum; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	35.0 psi	Mild Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	35.0 psi	Stainless Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	40.0 psi	Copper; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	55.0 psi	Zinc Plated Steel; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	90.0 psi	Aluminum (Grit Blasted); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	95.0 psi	Mild Steel (Grit Blasted); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	145 psi	Phenolic; Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587
	185 psi	Steel (e-coated); Lap Shear, cured 21 days, 22°C; 50% RH; 0.5 mm gap; ISO 4587

Electrical Properties	Original Value	Comments
Volume Resistivity	5.50e+15 ohm-cm	cured 21 days, 22°C; 45-55% RH; IEC 60093
Surface Resistance	2.00e+17 ohm	cured 21 days, 22°C; 45-55% RH; IEC 60093

Thermal Properties	Original Value	Comments
CTE, linear	340 µm/m-°C	cured 21 days, 22°C; 45-55% RH; ISO 11359-1
Maximum Service Temperature, Air	662 °F

Processing Properties	Original Value	Comments
Cure Time	6.00 hour @Thickness 2.00 mm	room temp
	68.0 hour @Thickness 5.00 mm	room temp
	168 hour @Thickness 10.5 mm	room temp

Descriptive Properties
Color	Copper
Extrusion Rate	>275 g/min	Semco Cartridge
Gap Fill	0.24 in.
Tack Free Time	20 - 60 min.	22°C; 45-55% RH

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