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Ensinger PEI

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Hapco DI-PAK™ R-4806 Potting and Encapsulating Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: Low viscosity, fast cure, high performance, potting and encapsulating compounds with excellent properties and FAST TURNOVER. Both are two part systems with 1:1 mix ratios by volume.

Information provided by Hapco, Inc.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.10 g/ccASTM D-4669
Viscosity 500 cPASTM D-4878
Linear Mold Shrinkage 0.0020 - 0.0040 in/inASTM D-2566
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 79ASTM D-2240
Tensile Strength 6370 psiASTM D-638
Elongation at Break 9.5 %ASTM D-638
Modulus of Elasticity 158 ksiASTM D-638
Flexural Strength 7000 psiASTM D-790
Flexural Modulus 172 ksiASTM D-790
Izod Impact, Notched 0.700 ft-lb/inASTM D-256
Izod Impact, Unnotched 1.60 ft-lb/inASTM D-256
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.70e+14 ohm-cmASTM D-270
Dielectric Constant 3.6
@Frequency 100000 Hz		ASTM D-150
 3.7
@Frequency 1000 Hz		ASTM D-150
Dielectric Strength 460 V/milASTM D-149
Dissipation Factor 0.020
@Frequency 100000 Hz		ASTM D-150
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.50 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert 120 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 15.0 - 30.0 min
@Thickness 3.17 mm		Demold
Gel Time 1.50 - 2.00 min
@Load 0.100 kg		ASTM D-2971
 
Descriptive Properties
Color (cured)Opaque tan/yellow
Mix Ratio100:100Volume
 100:96Weight

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PHAPCO049 / 317108

Proto3000 – 3D Engineering Solutions




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