ASI® MP 5471 Epoxy Adhesive

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ASI® MP 5471 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP 5471 is a clear, two part unfilled electronics grade epoxy resin system. It was designed for applications where fast cure and excellent high temperature thermal stability is required. It cures very quickly at room temperatures to a tough, rigid polymer. It has good wetting and adhesion to most surfaces and has a free-flowing viscosity. It has excellent thermal stability and very good resistance to water, acids and bases and most organic solvents. Information provided by Adhesive Systems, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.12 g/cc	part B
	1.16 g/cc	part A
	1.16 g/cc	mixed
Viscosity	1000 cP	part A
	1100 cP	mixed
	10000 cP	part B

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	instantaneous
Tensile Strength	8500 psi
Elongation at Break	3.0 - 4.0 %

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 8.30e+14 ohm-cm @Temperature 25.0 °C
Dielectric Constant	3.5 @Frequency 100 Hz, Temperature 25.0 °C
Dielectric Strength	415 V/mil

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	180 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Cure Time	24.0 hour @Temperature 25.0 °C
Pot Life	60.0 - 75.0 sec	5 grams
Shelf Life	12.0 Month

Descriptive Properties
Color / appearance	clear
Mix Ratio	10:1 by volume (Part A to B)
	9.5:1 by weight (Part A to B)

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PASINC9096 / 233463

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