Parker Chomerics THERM-A-GAP 570 Thermally Conductive Gap Filler

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Parker Chomerics THERM-A-GAP 570 Thermally Conductive Gap Filler
Categories:	Polymer; Thermoset; Filled/Reinforced Thermoset; Rubber or Thermoset Elastomer (TSE)
Material Notes:	THERM-A-GAP™ 570 is a highly conformal, thermally conductive gap filler pad. The materials consist of an ultra-soft silicone elastomer filled with ceramic particles. THERM-A-GAP™ elastomers are used to fill air voids between PC boards or high temperature components and heat sinks, metal enclosures, and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, wetting out mating surfaces in order to efficiently transfer heat away from components. Typical Applications: Telecommunications equipment; Consumer electronics; Automotive electronics (ECUs); LEDs, lighting; Power conversion; Desktop computers; laptops, servers; Handheld devices; Memory modules and Vibration dampening Product Attributes: Best for molding complex parts and vibration dampening and Lowest outgassing Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	2.20 g/cc	ASTM D792
Thickness	20.0 - 200 mil	ASTM D374
Deformation	10 % @Thickness 3.17 mm, Pressure 0.0345 MPa	0.5" diameter probe, 0.025 in/min rate; ASTM C165 MOD
	15 % @Thickness 3.17 mm, Pressure 0.0689 MPa	0.5" diameter probe, 0.025 in/min rate; ASTM C165 MOD
	25 % @Thickness 3.17 mm, Pressure 0.172 MPa	0.5" diameter probe, 0.025 in/min rate; ASTM C165 MOD
	25 % @Thickness 2.54 mm, Pressure 0.0689 MPa	0.75" diameter round probe with 0.75" diameter circular sample; Method 2
	32 % @Thickness 2.54 mm, Pressure 0.138 MPa	0.75" diameter round probe with 0.75" diameter circular sample; Method 2
	35 % @Thickness 3.17 mm, Pressure 0.345 MPa	0.5" diameter probe, 0.025 in/min rate; ASTM C165 MOD
	35 % @Thickness 2.54 mm, Pressure 0.0689 MPa	1" square probe with 0.5" diameter circular sample; Method 1
	40 % @Thickness 2.54 mm, Pressure 0.276 MPa	0.75" diameter round probe with 0.75" diameter circular sample; Method 2
	42 % @Thickness 2.54 mm, Pressure 0.138 MPa	1" square probe with 0.5" diameter circular sample; Method 1
	48 % @Thickness 2.54 mm, Pressure 0.276 MPa	1" square probe with 0.5" diameter circular sample; Method 1
	48 % @Thickness 2.54 mm, Pressure 0.414 MPa	0.75" diameter round probe with 0.75" diameter circular sample; Method 2
Outgassing - Total Mass Loss	0.35 %	TML; ASTM E595
Collected Volatile Condensable Material	0.090 %	ASTM E595

Mechanical Properties	Original Value	Comments
Hardness, Shore OO	25	ASTM D2240

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+14 ohm-cm	ASTM D257
Dielectric Constant	6.5 @Frequency 1e+6 Hz	ASTM D150
Dielectric Strength	200 V/mil
Dissipation Factor	0.013 @Frequency 1e+6 Hz	Chomerics Test

Thermal Properties	Original Value	Comments
CTE, linear	250 µm/m-°C	ASTM E831
Specific Heat Capacity	1.00 J/g-°C	ASTM E1269
Thermal Conductivity	1.50 W/m-K	ASTM D5470
Maximum Service Temperature, Air	200 °C
Minimum Service Temperature, Air	-55.0 °C
Flammability, UL94	V-0

Processing Properties	Original Value	Comments
Shelf Life	18.0 Month	From date of shipment A; Chomerics
	24.0 Month	From date of shipment G; Chomerics

Descriptive Properties
Carrier	G=Fiberglass, A=Aluminum
Color	Blue

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