Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound

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Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic; Phenolic, Novolac, Heat Resistant Grade, Filled
Material Notes:	Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical properties, it has found use in a wide variety of wiring device applications. Data provided by Plaslok Corporation. Plaslok Corporation was purchased by Plastics Engineering Company in March 2000. The Plaslok name is no longer used on any products.
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Physical Properties	Original Value	Comments

Density	1.54 g/cc	ASTM D792
Apparent Bulk Density	0.600 g/cc	ASTM D1895
Water Absorption	0.20 %	ASTM D570
Linear Mold Shrinkage	0.012 cm/cm	Injection; ASTM D955

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	52.0 MPa	ASTM D638
Flexural Yield Strength	86.0 MPa	ASTM D790
Flexural Modulus	9.00 GPa	ASTM D790
Compressive Yield Strength	193 MPa	ASTM D695

Electrical Properties	Original Value	Comments
Electrical Resistivity	1.00e+12 ohm-cm	ASTM D257
Dielectric Constant	5.0 @Frequency 1e+6 Hz	ASTM D150
	7.0 @Frequency 60 Hz	ASTM D150
Dielectric Strength	15.7 kV/mm	ASTM D149
Dissipation Factor	0.040 @Frequency 1e+6 Hz	ASTM D150
	0.090 @Frequency 60 Hz	ASTM D150
Comparative Tracking Index	180 V	UL 746

Thermal Properties	Original Value	Comments
Deflection Temperature at 1.8 MPa (264 psi)	166 °C	ASTM D648
UL RTI, Electrical	150 °C @Thickness 1.47 mm
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm
Flammability, UL94	V-0 @Thickness 1.47 mm
	V-0 @Thickness 1.47 mm

**
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PLEO908 / 50797

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