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Rulon Bearings

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Hexcel® Redux® 319L High Performance Modified Epoxy Film Adhesive (0.036 psf)
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Redux 319 is a high performance modified epoxy film adhesive curing at 350°F. It is available in both supported and unsupported versions at areal weights between 0.03 and 0.08 psf. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content.

Features: Cures in 60 min at 350°F; Good performance at temperatures ranging from -67°F to 300°F; Good short-term exposure performance at 350°F; Excellent peel properties; Good drape at ambient temperatures; Less than 1% volatile content.
Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.

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Mechanical PropertiesOriginal ValueComments
Shear Strength 3.19 ksi
@Temperature 149 °C
Lap Shear
 6.09 ksi
@Temperature 22.2 °C
Lap Shear
Peel Strength 39.0 pli
@Temperature 22.2 °C
Bell Peel
 
Processing PropertiesOriginal ValueComments
Shelf Life 18.0 Month
@Temperature -17.8 °C
 
Descriptive Properties
Areal Weight (psf)0.036
Climbing Drum Peel (in-lb/3in)60.5872°F
Standard Roll (ft2)540
SupportNone

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