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Master Bond adhesives

Materion Beryllium Copper Alloy 25 Strip; 1/2HT (TH02) Temper (UNS C17200)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: 2 hrs @ 315ºC
Stress Relaxation-% Stress Remaining after 1000 hrs @ 100°C: 97%
Stress Relaxation after 1000 hrs @ 200°C: 73%
Superficial Hardness: 30N 58-63

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-194, QQ-C-533
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Physical PropertiesMetricEnglishComments
Density 8.36 g/cc0.302 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell C 38 - 4438 - 44
Hardness, Vickers 373 - 435373 - 435
Tensile Strength, Ultimate 1270 - 1490 MPa184000 - 216000 psi
Tensile Strength, Yield 1100 - 1320 MPa160000 - 191000 psi
Elongation at Break 1.0 - 8.0 %1.0 - 8.0 %
Modulus of Elasticity 131 GPa19000 ksi
Fatigue Strength 290 - 320 MPa
@# of Cycles 1.00e+8
42100 - 46400 psi
@# of Cycles 1.00e+8
Reverse Bending (R=1)
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000610 - 0.00000780 ohm-cm0.00000610 - 0.00000780 ohm-cm22-28% IACS Conductivity
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
9.44 µin/in-°F
@Temperature 68.0 - 392 °F
Thermal Conductivity 105 W/m-K729 BTU-in/hr-ft²-°F
Melting Point 870 - 980 °C1600 - 1800 °F
Solidus 870 °C1600 °F
Liquidus 980 °C1800 °F
 
Component Elements PropertiesMetricEnglishComments
Beryllium, Be 1.8 - 2.0 %1.8 - 2.0 %
Co + Ni >= 0.20 %>= 0.20 %
Co + Ni + Fe <= 0.60 %<= 0.60 %
Copper, Cu 98 %98 %as balance
Lead, Pb <= 0.020 %<= 0.020 %

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