Thermal Ceramics Min-K Moldable

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Thermal Ceramics Min-K Moldable
Categories:	Ceramic; Oxide; Silicon Oxide
Material Notes:	Thermal Ceramics Min-K Moldable is a bulk wet form of our Min-K microporous product offering. Min-K Moldable can be extruded into shape, troweled or hand placed into areas where other insulation forms cannot be installed. Min-K Moldable requires no special curing or dry out schedule. The product can be air dried or dry time can be accelerated by applying heat to drive off water. As a microporous material, Min-K Moldable is extremely thermally efficient making it the perfect insulation for applications where space and weight are critical factors. Min-K Moldable can be used in combination with Min-K Flexible to provide an excellent backup insulation system. Min-K Moldable allows the user to insulate around complex geometries without extensive field fabrication or complex tools. Features: Extrudable form of microporous insulation Extremely thermally efficient Dries to 16 pcf (256 kg/m3))density Versatile placement options Information provided by Thermal Ceramics Data has not been recently verified. Please contact manufacturer for current information.
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Physical Properties	Original Value	Comments

Loss On Ignition	8.0 %

Thermal Properties	Original Value	Comments
Thermal Conductivity	0.2244 BTU-in/hr-ft²-°F @Temperature 23.9 °C	Dry sample thickness before test-0.431"
	0.2385 BTU-in/hr-ft²-°F @Temperature 93.3 °C	Dry sample thickness before test-0.431"
	0.3261 BTU-in/hr-ft²-°F @Temperature 260 °C	Dry sample thickness before test-0.431"
	0.496 BTU-in/hr-ft²-°F @Temperature 538 °C	Dry sample thickness before test-0.431"
	0.663 BTU-in/hr-ft²-°F @Temperature 816 °C	Dry sample thickness before test-0.38"
Maximum Service Temperature, Air	1400 °F
Shrinkage	2.0 - 4.0 %	Drying shrinkage
	2.0 % @Temperature 649 °C, Time 14400 sec

Component Elements Properties	Original Value	Comments
Al2O3	0.41 %
CaO	4.71 %
Fe2O3	0.25 %
K2O	<= 0.05 %
MgO	0.90 %
NaO2	0.14 %	As NaO
SiO2	75 %
TiO2	10.5 %

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CTHERM213 / 2533

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