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solder replacement adhesives

Sandvik Osprey HTN 12 Brazing Powder
Categories: Metal; Nonferrous Metal; Cobalt Alloy; Solder/Braze Alloy

Material Notes: Particle size distribution 1-250 microns.

SHAPE: Predominantly spherical. Chemical composition and particle size distribution can be adjusted to suit customers' requirements.

The specifications listed are subject to the benefits and scrutiny of Osprey's accreditation to ISO 9001.

Information provided to MatWeb by Osprey Metals, now Sandvik Osprey Ltd.

Key Words: Powder metallurgy, Metal Powder, Brazing Alloy
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Thermal PropertiesMetricEnglishComments
Melting Point 1120 - 1150 °C2050 - 2100 °F
Solidus 1120 °C2050 °F
Liquidus 1150 °C2100 °F
 
Component Elements PropertiesMetricEnglishComments
Aluminum, Al <= 0.050 %<= 0.050 %
Boron, B 0.70 - 0.90 %0.70 - 0.90 %
Carbon, C 0.35 - 0.45 %0.35 - 0.45 %
Chromium, Cr 18 - 20 %18 - 20 %
Cobalt, Co 50.8 %50.8 %As Balance
Nickel, Ni 16 - 18 %16 - 18 %
Other <= 0.50 %<= 0.50 %
Phosphorus, P <= 0.020 %<= 0.020 %
Selenium, Se <= 0.0050 %<= 0.0050 %
Silicon, Si 7.5 - 8.5 %7.5 - 8.5 %
Titanium, Ti <= 0.050 %<= 0.050 %
Tungsten, W 3.5 - 4.5 %3.5 - 4.5 %
Zirconium, Zr <= 0.050 %<= 0.050 %

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NOSPR156 / 18678

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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