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Master Bond adhesives

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LG Chemical PI642G ABS, General Purpose, High Modulus  (discontinued **)
Categories: Polymer; Thermoplastic; ABS Polymer; Acrylonitrile Butadiene Styrene (ABS), Extruded

Material Notes: Feature: Extrusion Molding, General Purpose, High Modulus

Application: Pipe fitting

CAS No. 9003-56-9

Information provided by LG Chemical

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.04 g/ccASTM D792
Maximum Moisture Content 0.010Extrusion Molding
Linear Mold Shrinkage, Flow 0.0040 - 0.0070 cm/cm
@Thickness 3.20 mm
ASTM D955
Melt Flow 8.0 g/10 min
@Load 10.0 kg,
Temperature 220 °C
ASTM D1238
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell R 110ASTM D785
Tensile Strength, Yield 570 kg(f)/cm²
@Thickness 3.20 mm
50 mm/min; ASTM D638
Elongation at Break 30 %
@Thickness 3.20 mm
50 mm/min; ASTM D638
Elongation at Yield >= 5.0 %
@Thickness 3.20 mm
50 mm/min; ASTM D638
Flexural Yield Strength 900 kg(f)/cm²
@Thickness 3.20 mm
15 mm/min; ASTM D790
Flexural Modulus 28000 kg(f)/cm²
@Thickness 3.20 mm
15 mm/min; ASTM D790
Izod Impact, Notched 24.0 kg-cm/cm
@Thickness 6.40 mm,
Temperature 23.0 °C
ASTM D256
 27.0 kg-cm/cm
@Thickness 3.20 mm,
Temperature 23.0 °C
ASTM D256
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 92.0 °C
@Thickness 6.40 mm
Unannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 86.0 °C
@Thickness 6.40 mm
Unannealed; ASTM D648
Vicat Softening Point 94.0 °C
@Load 5.00 kg
50°C/h; ASTM D1525
 
Processing PropertiesOriginal ValueComments
Zone 1 180 - 210 °CExtrusion Molding
Zone 2 190 - 230 °CExtrusion Molding
Zone 3 200 - 250 °CExtrusion Molding
Zone 4 200 - 250 °CExtrusion Molding
Adapter Temperature 200 - 250 °CExtrusion Molding
Die Temperature 200 - 250 °CExtrusion Molding
Melt Temperature 200 - 250 °CExtrusion Molding
Roll Temperature 60.0 - 90.0 °CBottom, Extrusion
 70.0 - 90.0 °CMiddle, Extrusion
 70.0 - 100 °CTop, Extrusion
Drying Temperature 70.0 - 80.0 °CExtrusion Molding
Dry Time 3.00 - 4.00 hourExtrusion Molding

**
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