Superior Flux Superior No-Clean Core Flux

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Superior Flux Superior No-Clean Core Flux
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	Excellent choice for electronics soldering applications. Residues do not require removal. Description: Superior No-Clean Core Flux is formulated for loading into No-Clean cored solder wire. This product meets the requirements specified in ANSI-J-STD-006 and Bellcore specifications on soldering fluxes. Superior No-Clean Core Flux is halide-free and may be left on assemblies post-soldering. The fluxing activity of this No-Clean, halide-free core flux is greater than that of many RMA type fluxes. Applications: Superior No-Clean Core Flux was formulated for the manufacture of No-Clean core solder wire in Conventional Lead-Free and Tin/Lead alloys. Its unique melting range and solidification temperature is compatible with the temperature parameters generally found during solder extrusion. A flux load of 0.8 to 1.2 percent by weight is recommended for No-Clean solder wire, however certain other loads, less or more, can be used. The flux residue is non-conductive and non-corrosive after soldering. No cleaning is required in most applications. Information provided by Superior Flux
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Processing Properties	Metric	English

Shelf Life	2.00 Month	2.00 Month

Descriptive Properties
Color	Light Straw
Form	Semi-Solid

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NSFLUX119 / 185803

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