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Chemically Resistant adhesives

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Epoxies, Etc 20-3300 High Temperature And Thermal Shock Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength. 20-3300 is ideal for high heat and thermal shock exposure. It has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Great choice for high voltage applications. 20-3300 has a convenient 1:1 mix ratio with an extended pot life.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.40 g/cc
Viscosity 12000 cPMixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 87
Tensile Strength 7500 psi
Compressive Strength 20000 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 3.30e+15 ohm-cm
Dielectric Constant 4.0
@Frequency 60 Hz
Dielectric Strength 450 V/mil
Dissipation Factor 0.010
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 38.0 µm/m-°C
Thermal Conductivity 0.580 W/m-K
Maximum Service Temperature, Air 260 °C
Minimum Service Temperature, Air -70.0 °C
 
Descriptive Properties
Mix Ratio1:1by weight

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PFEPOX036 / 316713

Chemically Resistant adhesives

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