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Master Bond adhesives

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Morgan Advanced Ceramics Deranox™ 999 >99% Alumina
Categories: Ceramic; Oxide; Aluminum Oxide

Material Notes: Exceptional mechanical, thermal, electrical, and chemical properties. High purity grades that can also be used for metallized applications.

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Physical PropertiesOriginal ValueComments
Density 3.75 - 3.95 g/ccFired
Porosity 0.00 %Apparent, fully dense grades
Particle Size 1.0 - 12 µmGrain size
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell 45 N 81 - 86
Vickers Microhardness 14300 - 18500MPa, at Hv 0.5kg
Modulus of Elasticity 370 - 400 GPa
@Temperature 20.0 °C
Flexural Strength 310 - 500 MPa
@Temperature 20.0 °C
3-point
Compressive Strength 2000 - 2500 MPa
Fracture Toughness 4.00 MPa-m½
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+7 - 6.00e+8 ohm-cm
@Temperature 600 °C
 1.00e+14 - 1.00e+17 ohm-cm
@Temperature 20.0 °C
Dielectric Constant 9.3
@Frequency 1e+9 Hz
 9.7 - 10
@Frequency 9.40e+9 Hz
 9.7 - 10.1
@Frequency 1e+6 Hz
Dielectric Strength 20.0 - 31.5 kV/mm
@Thickness 2.00 - 3.00 mm,
Temperature 20.0 °C
DC
Dissipation Factor 0.00014
@Frequency 1e+9 Hz
Dielectric Loss Index 0.00029
@Frequency 1e+7 Hz
K*tan delta
 0.00050 - 0.00080
@Frequency 1e+6 Hz
 0.00050 - 0.0010
@Frequency 9.40e+9 Hz
 0.00084
@Frequency 8.50e+9 Hz
K*tan delta
 0.0013
@Frequency 1e+9 Hz
K*tan delta
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.90 - 8.90 µm/m-°C
@Temperature 20.0 °C
 8.50 - 9.00 µm/m-°C
@Temperature 800 °C
Specific Heat Capacity 0.880 J/g-°C
Thermal Conductivity 12.5 W/m-K
@Temperature 400 °C
 25.6 - 30.0 W/m-K
@Temperature 20.0 °C
Maximum Service Temperature, Air 1500 - 1725 °C
 
Component Elements PropertiesOriginal ValueComments
Al2O3 99.9 %
 
Descriptive Properties
Te Value975°C
Thermal Downshock160-210Change in °C

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CMORG24 / 90402

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