LORD CoolTherm™ SC-104 thermally conductive encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. CoolTherm SC-104 encapsulant can be either room temperature cured or heat cured for maximum adhesion. CoolTherm SC-104 hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas. Features: exhibits low shrinkage and stress on components as it cures. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials. provides excellent thermal shock resistance. provides excellent flame retardancy; UL 94 V-0 certified. ingredients contained in CoolTherm SC-104 encapsulant are permitted for food contact under FDA food additive regulations (21CFR175.300) when material is properly proportioned, mixed, applied and cured. All information provided by Lord. |