ASI® MP 5401 Epoxy Adhesive

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ASI® MP 5401 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP 5401 is a one component, heat curable thixotropic paste epoxy adhesive. It is a non-sag adhesive, which forms strong bonds to metals and ceramics. MP 5401 has exceptional thermal stability and resistance to water, humidity and solvents. This product offers high heat resistance and cures in less than 36 seconds via induction or infrared heating. Information provided by Adhesive Systems, Inc.
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Physical Properties	Metric	English	Comments

Specific Gravity	1.46 g/cc @Temperature 25.0 °C	1.46 g/cc @Temperature 77.0 °F
Viscosity	700000 - 900000 cP @Temperature 25.0 °C	700000 - 900000 cP @Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	86 @Temperature 25.0 °C	86 @Temperature 77.0 °F
Tensile Strength	46.7 MPa	6770 psi
Elongation at Break	>= 1.5 %	>= 1.5 %
Adhesive Bond Strength	22.1 MPa	3200 psi	Lap Shear
Izod Impact, Notched	0.192 J/cm	0.360 ft-lb/in

Thermal Properties	Metric	English	Comments
CTE, linear	57.2 µm/m-°C	31.8 µin/in-°F
Thermal Conductivity	2.82 W/m-K	19.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	204 °C	400 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	148 °C	298 °F

Processing Properties	Metric	English	Comments
Cure Time	1.00 min @Temperature 177 °C	0.0167 hour @Temperature 350 °F
	2.00 min @Temperature 149 °C	0.0333 hour @Temperature 300 °F
	10.0 min @Temperature 121 °C	0.167 hour @Temperature 250 °F
Shelf Life	0.500 Month @Temperature 38.0 °C	0.500 Month @Temperature 100 °F
	6.00 Month @Temperature 24.0 °C	6.00 Month @Temperature 75.2 °F
	12.0 Month @Temperature <=0.000 °C	12.0 Month @Temperature <=32.0 °F	Store in a cool, dry area

Descriptive Properties
Color / appearance	gray
Press Flow	70-90 sec
Sag Resistance	0.375"-0.42"
Unleaded Gasoline Resistance	100% strength retained after 1500 hrs of submersion.

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PASINC9100 / 233467

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