Cookson Group Plaskon® MUF-2B Molded Underfill Compound for Flip Chip BGAs and CSPs

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Cookson Group Plaskon® MUF-2B Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher Tg Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC Level 3 Applications: Plaskon MUF-2B Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential. Mold Applications: Plaskon MUF-2A is suitable to vent hole assist molding approaches for underfilling flip chip packages. It will work in matrix, strip and singulated molds. Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.89 g/cc
Viscosity	5000 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage	0.00050 cm/cm
Spiral Flow	125 cm	at 175°C and 1000 psi
Ash	80 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	Cull hot
Flexural Strength	12090 psi
	4978.2 psi @Temperature 215 °C
Flexural Modulus	2.560e+6 psi
	853400 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	4.50e+15 ohm-cm
Dielectric Constant	3.13 @Frequency 1000 Hz
Dielectric Strength	>= 800 V/mil
Dissipation Factor	0.0017 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	55.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.750 W/m-K
Glass Transition Temp, Tg	195 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	165 - 170 °C
Back Pressure	500 - 900 psi
Cure Time	100 - 200 sec	In mold
Gel Time	0.233 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm
Preform Temperature	80-85°C
Transfer Time	6-15 seconds

**
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PPLASK033 / 56323

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