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Master Bond adhesives

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Hapco DI-PAK™ R-4807 Potting and Encapsulating Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: Low viscosity, fast cure, high performance, potting and encapsulating compounds with excellent properties and FAST TURNOVER. Both are two part systems with 1:1 mix ratios by volume.

Information provided by Hapco, Inc.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.10 g/ccASTM D-4669
Viscosity 240 cPASTM D-4878
Linear Mold Shrinkage 0.0015 - 0.0030 in/inASTM D-2566
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 84ASTM D-2240
Tensile Strength 6200 psiASTM D-638
Elongation at Break 11 %ASTM D-638
Modulus of Elasticity 340 ksiASTM D-638
Flexural Strength 8700 psiASTM D-790
Flexural Modulus 361 ksiASTM D-790
Izod Impact, Notched 0.230 ft-lb/inASTM D-256
Izod Impact, Unnotched 1.30 ft-lb/inASTM D-256
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.50e+14 ohm-cmASTM D-270
Dielectric Constant 3.63
@Frequency 100000 Hz		ASTM D-150
 3.77
@Frequency 1000 Hz		ASTM D-150
Dielectric Strength 465 V/milASTM D-149
Dissipation Factor 0.22
@Frequency 100000 Hz		ASTM D-150
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.50 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert 70.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 60.0 min
@Thickness 3.17 mm		Demold
Gel Time 3.50 - 4.50 min
@Load 0.100 kg		ASTM D-2971
 
Descriptive Properties
Color (cured)Black
Mix Ratio100:100Volume
 100:93Weight

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PHAPCO050 / 317109




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