Hapco DI-PAK™ R-4525/17 Potting and Encapsulating Compound

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Hapco DI-PAK™ R-4525/17 Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK™ R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained. Information provided by Hapco, Inc.
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Physical Properties	Metric	English	Comments

Specific Gravity	1.43 g/cc	1.43 g/cc	ASTM D-4669
Viscosity	1800 cP	1800 cP	ASTM D-4878
Linear Mold Shrinkage	0.00050 - 0.0010 cm/cm	0.00050 - 0.0010 in/in	ASTM D-2566

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	90	90	ASTM D-2240
Tensile Strength	56.9 MPa	8250 psi	ASTM D-638
Elongation at Break	3.8 %	3.8 %	ASTM D-638
Modulus of Elasticity	2.48 GPa	360 ksi	ASTM D-638
Flexural Strength	65.2 MPa	9450 psi	ASTM D-790
Flexural Modulus	2.67 GPa	387 ksi	ASTM D-790
Izod Impact, Notched	0.192 J/cm	0.360 ft-lb/in	ASTM D-256
Izod Impact, Unnotched	0.406 J/cm	0.760 ft-lb/in	ASTM D-256

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.90e+12 ohm-cm	2.90e+12 ohm-cm	ASTM D-270
Dielectric Constant	3.3 @Frequency 100000 Hz	3.3 @Frequency 100000 Hz	ASTM D-150
	3.4 @Frequency 1000 Hz	3.4 @Frequency 1000 Hz	ASTM D-150
Dielectric Strength	22.8 kV/mm	579 kV/in	ASTM D-149
Dissipation Factor	0.023 @Frequency 100000 Hz	0.023 @Frequency 100000 Hz	ASTM D-150

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.403 W/m-K	2.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert	75.0 °C	167 °F

Processing Properties	Metric	English	Comments
Cure Time	1440 min @Thickness 3.17 mm	24.0 hour @Thickness 0.125 in	Demold
Gel Time	40.0 - 60.0 min @Load 0.100 kg	40.0 - 60.0 min @Load 0.221 lb	ASTM D-2971

Descriptive Properties
Color (cured)	Black
Mix Ratio	100:24		Weight
	100:40		Volume

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PHAPCO034 / 317093

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