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Master Bond adhesives

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Hexcel® HexBond™ EA9686.09 K Epoxy Film
Categories: Polymer; Thermoset; Epoxy

Material Notes: Description: HexBond™ EA9686 is a 120°C/250°F cure film adhesive designed for metal, composite and honeycomb bonding applications. Its formulation based on epoxy resin provides a structural resistance over a large temperature range with a good toughness.

Features:

  • Good peel strength
  • Cure from 110°C/230°F to 135°C/275°F (the adhesive can withstand cure up to 177°C/350°F)
  • Storage life: 1 year at or below -18°C/0°F + 4 weeks at room temperature (= 23°C/73°F)
  • Low volatile content (< 1%)
Applications:
  • Metal-to-metal bonding
  • Sandwich construction
  • Composite-to-composite bonding

Information provided by Hexcel Corporation.

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Mechanical PropertiesOriginal ValueComments
Adhesive Bond Strength 25.0 MPa
@Temperature 120 °C
Lap Shear; EN 2243-1
 30.0 MPa
@Temperature 100 °C
Lap Shear; EN 2243-1
 42.0 MPa
@Temperature 22.8 °C
Lap Shear; EN 2243-1
Peel Strength 46.0 pli
@Temperature 23.0 °C
IGC 04.26.360B
 47.0 pli
@Temperature 100 °C
IGC 04.26.360B
 
Thermal PropertiesOriginal ValueComments
Glass Transition Temp, Tg 89.0 °CWet, 1.5h at 135°C
 89.0 °CWet, 5h at 110°C
 125 °CAs received, 1.5h at 135°C
 129 °CAs received, 5h at 110°C
 
Descriptive Properties
ColorPink

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PHEXCB9269 / 322425

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