CEN® Electronic Material CF 200CF919 Polyimide Film

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CEN® Electronic Material CF 200CF919 Polyimide Film
Categories:	Polymer; Film; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	CEN®CF polyimide film is the general CEN®CN film that is coated or laminated on one or both sides with Teflon® FEP fluoropolymer. CEN®CF imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. Applications: require a heat bondable film, or moisture and chemical resistance beyond the capabilities of uncoated CEN®CN films, such as tubing, heater circuits, heat sealable bags, automotive diaphragms and manifolds, magnetic wire, PTC Insulation All information provided by CEN Electronic Material Co., LTD.
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Physical Properties	Original Value	Comments

Thickness	22.0 - 28.0 microns	Base; ASTM D374
	47.0 - 53.0 microns	Total; ASTM D374

Mechanical Properties	Original Value	Comments
Tensile Strength, Yield	>= 160 MPa	ASTM D882
Elongation at Yield	>= 45 %	ASTM D882
Peel Strength	>= 0.240 kN/m	IPC-TM-650

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+14 ohm	ASTM D257
Dielectric Strength	>= 200 kV/mm	ASTM D149

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CEN® Electronic Material BL Polyimide Film

PCENE008 / 93470

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