Redux® 312 is a high-strength 250°F curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 210°F may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control.Features: Short cure cycle - cures in 30 minutes at 250°F; Good mechanical performance up to 210°F; Suitable for composite to composite bonding; Low volatile content (solventless process). Applications: Metal to metal bonding; Sandwich constructions; Composite to composite bonding. |