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Chemically Resistant adhesives

Epoxies, Etc 20-2121 Elastomeric Potting & Encapsulating Compound
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: 20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling. The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.

Features:

  • Low Toxicity
  • Green
  • Low Viscosity
  • Low Durometer
  • Moisture Resistant
  • Convenient Mix Ratios
  • Low Shrinkage & Exotherm
Benefits:
  • Reduce employee exposure to dangerous chemicals
  • Reduce demand on non-renewable fossil fuels
  • Quick self leveling around components
  • Low stress on components & vibration resistant
  • Can be used in wet environments
  • Will not damage components during cure

Information provided by Epoxies, Etc

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Physical PropertiesMetricEnglishComments
Specific Gravity 0.960 g/cc0.960 g/ccPolyol Resin
 1.14 g/cc1.14 g/ccIsocyanate
Viscosity 800 cP800 cPPolyol Resin
 3200 cP3200 cPMixed
 20000 cP20000 cPIsocyanate
Linear Mold Shrinkage 0.014 cm/cm0.014 in/in
Storage Temperature 21.0 - 29.0 °C69.8 - 84.2 °F
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 6565
Tensile Strength 13.8 MPa2000 psi
Elongation at Break 155 %155 %
Tear Strength 20.9 kN/m119 pli
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.20e+14 ohm-cm7.20e+14 ohm-cm
Surface Resistance >= 1.00e+15 ohm>= 1.00e+15 ohm
Dielectric Constant 3.4
@Frequency 1000 Hz
3.4
@Frequency 1000 Hz
Dielectric Strength 25.6 kV/mm650 kV/in
Dissipation Factor 0.017
@Frequency 1000 Hz
0.017
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 210 µm/m-°C117 µin/in-°F
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 125 °C257 °F
Minimum Service Temperature, Air -30.0 °C-22.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  40.0 min
@Temperature 85.0 °C
0.667 hour
@Temperature 185 °F
 90.0 min
@Temperature 65.0 °C
1.50 hour
@Temperature 149 °F
 150 min
@Temperature 45.0 °C
2.50 hour
@Temperature 113 °F
 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
Gel Time  20.0 min
@Temperature 60.0 °C
20.0 min
@Temperature 140 °F
 90.0 min
@Temperature 25.0 °C
90.0 min
@Temperature 77.0 °F
 
Descriptive Properties
ColorClear/Amber
Mix Ratio100:94Iso:Polyol, by volume
 116:100Iso:Polyol, by weight

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

PFEPOX013 / 316690

Chemically Resistant adhesives

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