Resin Technology Group EN 139-2 UV Gellable, Low Temperature Cure, One-Component Epoxy Adhesive

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Resin Technology Group EN 139-2 UV Gellable, Low Temperature Cure, One-Component Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	EN 139-2 is a UV gellable, one-component epoxy based adhesive system designed to provide cure at temperatures as low as 80°C. This one-part adhesive gels to a tack-free, low strength polymer upon exposure to mid-range UV light. Complete cure can be realized at elevated temperatures and develops tough, strong bonds to a wide variety of materials, including metals, glass, ceramics and plastics. The cured material has high strength and good dimensional stability. Applications: Disk drive engineering products, Non-acrylic UV bonding. No outgassing concerns. Electronic-Opto, Fillet-tacking and staking. Processing: UV light cure: Intensity of 200 mw/cm2; Spectral output of 300 to 500 nanometers; Optimum wavelength of 375 nanometers Recommended Aurora UV light sources: Aurora 455-S 5x5 High Intensity Flood Aurora 461-S 1x6 High Intensity Beam Aurora 100-S Spot Light Guide Information provided by Resin Technology Group.
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Physical Properties	Metric	English	Comments

Viscosity	10000 cP @Temperature 25.0 °C	10000 cP @Temperature 77.0 °F	Uncured

Mechanical Properties	Metric	English	Comments
Shear Strength	15.9 MPa	2300 psi	Cured, tensile, Al/Al

Electrical Properties	Metric	English	Comments
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in	Cured

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	130 °C	266 °F	Cured
Minimum Service Temperature, Air	-50.0 °C	-58.0 °F	Cured
Flash Point	>= 93.3 °C	>= 200 °F	Uncured

Descriptive Properties
Color	Natural
Composition	Epoxy
Moisture Resistance	Excellent		Cured
Toxicity	Low

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PRESINT647 / 65531

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