| Description: Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance. T660 contains solder fillers for extremely low thermal impedance at thinner bondline thicknesses Features/Benefits: Silicone based materials conduct heat between a hot component and a heat sink or enclosure; Fills interface variable tolerances in electronics assemblies and heat sink applications; Dispensable, highly conformable materials require non cure cycle, mixing or refrigeration; Thermally stable and require virtually no compressive fore to deform under typical assembly pressures; Supports high power applications requiring material with minimum bond line thickness and high conductivity and Ideal for rework and field repair situations. Typical Applications: Mobile, desktop, server CPUs; Engine and transmission control modules; Memory modules; Power conversion equipment; Power supplies and UPS and Power semiconductors. Information provided by Chomerics |
