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solder replacement adhesives

AIM 54Sn/26Pb/20In Solder for Photonic Packaging
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy; Tin Alloy

Material Notes: Uses include:
  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Information provided by AIM Specialty Materials.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.10 g/cc0.293 lb/in³
 
Thermal PropertiesMetricEnglishComments
CTE, linear 25.0 µm/m-°C
@Temperature 20.0 °C
13.9 µin/in-°F
@Temperature 68.0 °F
Melting Point 138 - 170 °C280 - 338 °F
Solidus 138 °C280 °F
Liquidus 170 °C338 °F
 
Component Elements PropertiesMetricEnglishComments
Indium, In 20 %20 %
Lead, Pb 26 %26 %
Tin, Sn 54 %54 %
 
Descriptive Properties
Creep ResistanceModerate

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NAIMSP20 / 14601

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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