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Master Bond adhesives

Park Aerospace Nelco® N4000-13 High-Speed Multifunctional Epoxy Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco® N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI® is excellent for applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF and thermal resistance.

Key Features and Benefits:

  • Lead-Free Assembly Compatible
  • Tg >210ºC, outstanding thermal, electrical and signal loss properties
  • CAF Resistant
  • Signal Integrity and Buried Capacitance™ Options
  • High-Tg FR-4 processing
  • Available in a variety of constructions

Applications/Qualifications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-Ls
  • CSP Attachment
  • Wireless Communications Infrastructure
  • High Speed Services
  • High Speed Storage Networks
  • Internet Switching / Routing Systems

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.91 g/cc0.0690 lb/in³50% Resin Content; Internal Method
Water Absorption 0.10 %0.10 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 22.8 GPa3300 ksiY; ASTM D3039
 29.0 GPa4200 ksiX; ASTM D3039
Poissons Ratio 0.110.11Y; ASTM D3039
 0.130.13X; ASTM D3039
Peel Strength 1.31 kN/m7.50 pliafter solder float; IPC-TM-650.2.4.8
 1.42 kN/m8.10 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 1.58 kN/m9.00 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
 1.00e+14 ohm-cm1.00e+14 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohm1.00e+13 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant  3.6
@Frequency 1e+10 Hz
3.6
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.7
@Frequency 1e+10 Hz
3.7
@Frequency 1e+10 Hz
Split Post Cavity
 3.7
@Frequency 1e+9 Hz
3.7
@Frequency 1e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
 3.7
@Frequency 2.50e+9 Hz
3.7
@Frequency 2.50e+9 Hz
Split Post Cavity
Dielectric Strength 47.2 kV/mm1200 kV/inIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V>= 50000 VIPC-TM-650.2.5.6
Dissipation Factor  0.0080
@Frequency 1e+10 Hz
0.0080
@Frequency 1e+10 Hz
Split Post Cavity
 0.0090
@Frequency 2.50e+9 Hz
0.0090
@Frequency 2.50e+9 Hz
Split Post Cavity
 0.0090
@Frequency 1e+10 Hz
0.0090
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 123 sec123 secIPC-TM-650.2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear  10.0 - 14.0 µm/m-°C
@Temperature -40.0 - 125 °C
5.56 - 7.78 µin/in-°F
@Temperature -40.0 - 257 °F
X/Y; IPC-TM-650.2.4.41
 70.06 µm/m-°C
@Temperature 50.0 - 210 °C
38.92 µin/in-°F
@Temperature 122 - 410 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
 280.22 µm/m-°C
@Temperature 210 - 260 °C
155.68 µin/in-°F
@Temperature 410 - 500 °F
Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 1.21 J/g-°C0.290 BTU/lb-°FASTM E1461
Thermal Conductivity 0.350 W/m-K2.43 BTU-in/hr-ft²-°FASTM E1461
Glass Transition Temp, Tg 200 °C392 °FTMA; IPC-TM-650.2.4.24c
 210 °C410 °FDSC; IPC-TM-650.2.4.25c
 240 °C464 °FDMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 350 °C662 °F5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.7IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)>30IPC-TM-650.2.4.24.1
T288 (minutes)>10IPC-TM-650.2.4.24.1
Z Axis Expansion (%)3.550ºC to 260ºC; IPC-TM-650.2.4.41

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PPARK106 / 89378

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