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Master Bond adhesives

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Copper Alloy, UNS C19810, H02 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/2 Hard

Fabrication Properties: Good Suitability – Soldering, Brazing, Gas Shielded Arc Welding, Spot Weld, Capacity for Being Cold Worked, Capacity for Being Hot Formed

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Physical PropertiesOriginal ValueComments
Density 0.321 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Hardness, Vickers 132
@Load 0.500 kg
Tensile Strength 60.0 ksi
Tensile Strength, Yield 59.0 ksi0.2% Offset
Elongation at Break 15 %
Tensile Modulus 17000 ksi
Machinability 20 %
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000290 ohm-cm60% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.50 µin/in-°F
@Temperature 20.0 - 300 °C
Specific Heat Capacity 0.0920 BTU/lb-°F
Thermal Conductivity 145 BTU-in/hr-ft²-°F
Melting Point 1970 °F
Annealing Point >= 482 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 482 °FStress Relief
Hot-Working Temperature 1380 - 1740 °F
 
Component Elements PropertiesOriginal ValueComments
Chromium, Cr <= 0.090 %
Copper, Cu 91.5 - 97.5 %As Balance
Iron, Fe 1.5 - 3.0 %
Magnesium, Mg <= 0.10 %
Phosphorus, P <= 0.10 %
Titanium, Ti <= 0.10 %
Zinc, Zn 1.0 - 5.0 %
Zirconium, Zr <= 0.10 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC19810x1 / 291773

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