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Master Bond adhesives

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Daelim H&L Plavis G15 Aromatic Polyimide, 15% Graphite Filled, Machined Parts
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: High abrasion resistance, very low friction coefficient property, suitable for being applied to spin component of spin apparatus

Information provided by Daelim H&L

Key Words: PI
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Physical PropertiesOriginal ValueComments
Specific Gravity 1.49 g/ccASTM D792
Moisture Absorption at Equilibrium 0.90 %50% RH; ASTM D570
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 80 - 92ASTM D785
Tensile Strength, Ultimate 480 kg(f)/cm²
@Temperature 260 °C
ASTM D1708
 803 kg(f)/cm²
@Temperature 23.0 °C
ASTM D1708
Tensile Strength, Yield 601 kg(f)/cm²
@Strain 1 %
ASTM D95
Tensile Stress at Strain 1412 kg(f)/cm²
@Strain 10 %
ASTM D95
Elongation at Break 7.4 %
@Temperature 260 °C
ASTM D1708
 11.2 %
@Temperature 23.0 °C
ASTM D1708
Flexural Strength 64.7 MPa
@Temperature 260 °C
ASTM D790
 118.5 MPa
@Temperature 23.0 °C
ASTM D790
Flexural Modulus 26500 kg(f)/cm²
@Temperature 260 °C
ASTM D790
 38900 kg(f)/cm²
@Temperature 23.0 °C
ASTM D790
Compressive Modulus 2923.4 MPa
@Temperature 23.0 °C
ASTM D695
Izod Impact, Notched (ISO) 0.47088 J/cm²ASTM D256
Coefficient of Friction 0.20
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 - 1.00e+15 ohm-cm
@Temperature 23.0 °C
ASTM D257
Dissipation Factor 0.0104
@Frequency 1e+6 Hz,
Temperature 23.0 °C
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 4.70 µm/m-°C
@Temperature 23.0 - 260 °C
ASTM D696
Decomposition Temperature 616 °C
Oxygen Index 54.15 %ASTM D2863
 
Descriptive Properties
50% Weight Reduction Time (Minutes)240

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PDAEL003 / 82657

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