Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive

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Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	Long work life, thermally conductive urethane adhesive DIS-A-PASTE 2003-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2003A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Exceeds NASA outgassing requirements for high vacuum environments. Bonds DAT-A-THERM 1000 film to devices and substrates without loss of thermal conductivity. Available in pre-mixed frozen syringes. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2003A-.010/B. DIS-A-PASTE 2003-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2003-B is a clear, organic isocyanate. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	1.07 - 1.70 g/cc	0.0387 - 0.0614 lb/in³	B Component; ASTM D1475
	2.08 - 2.18 g/cc	0.0751 - 0.0788 lb/in³	A Component; ASTM D1475
Viscosity	2700 cP	2700 cP	B Component; ASTM D1824
	150000 cP	150000 cP	A Component; ASTM D1824
Outgassing - Total Mass Loss	0.27 %	0.27 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.0050 %	0.0050 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	80	80	Cured property; ASTM D2240
Tensile Strength, Ultimate	3.10 MPa	450 psi	Cured property; ASTM D638
Elongation at Break	90 %	90 %	Cured property; ASTM D638
Adhesive Bond Strength	1.79 MPa	260 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Electrical Properties	Metric	English	Comments
Volume Resistivity	2.00e+14 ohm-cm	2.00e+14 ohm-cm	Cured property; ASTM D257
Dielectric Constant	5.4 @Frequency 1000 Hz	5.4 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	24.4 kV/mm @Thickness 1.27 mm	620 kV/in @Thickness 0.0500 in	Cured; ASTM D149
Dissipation Factor	0.016 @Frequency 1000 Hz	0.016 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	31.0 µm/m-°C @Temperature 20.0 °C	17.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1
	137 µm/m-°C @Temperature 20.0 °C	76.1 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2
Thermal Conductivity	0.744 W/m-K	5.16 BTU-in/hr-ft²-°F	Cured property; COLORA
Glass Transition Temp, Tg	-60.0 °C	-76.0 °F	Cured property; JMTP P-200
Flash Point	>= 150 °C	>= 302 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	85.0 °C	185 °F	Cure 6 hrs
	100 °C	212 °F	Cure 4 hrs
	125 °C	257 °F	Cure 2 hrs

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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