Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound

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Plaslok 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic; Phenolic, Novolac, Woodflour/Mineral Filled
Material Notes:	Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation values and physical properties combined with versatile molding characteristics. Data provided by Plaslok Corporation.
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Physical Properties	Original Value	Comments

Density	1.37 g/cc	ASTM D792
Apparent Bulk Density	0.600 g/cc	ASTM D1895
Water Absorption	0.45 %	ASTM D570
Linear Mold Shrinkage	0.0060 cm/cm	Compression; ASTM D955

Mechanical Properties	Original Value	Comments
Tensile Strength, Ultimate	52.0 MPa	ASTM D638
Flexural Yield Strength	76.0 MPa	ASTM D790
Flexural Modulus	6.90 GPa	ASTM D790
Compressive Yield Strength	228 MPa	ASTM D695

Electrical Properties	Original Value	Comments
Electrical Resistivity	1.00e+12 ohm-cm	ASTM D257
Dielectric Constant	5.8 @Frequency 60 Hz	ASTM D150
	5.8 @Frequency 60 Hz	ASTM D150
Dielectric Strength	14.2 kV/mm	ASTM D149
Dissipation Factor	0.030 @Frequency 1e+6 Hz	ASTM D150
	0.060 @Frequency 60 Hz	ASTM D150
Comparative Tracking Index	140 V	UL 746

Thermal Properties	Original Value	Comments
Deflection Temperature at 1.8 MPa (264 psi)	168 °C	ASTM D648
UL RTI, Electrical	150 °C @Thickness 1.47 mm
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm
UL RTI, Mechanical without Impact	150 °C @Thickness 1.47 mm
Flammability, UL94	HB @Thickness 3.05 mm
	HB @Thickness 3.05 mm

**
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PZ90P00 / 21085

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