Description: HexPly® M76 is a versatile curing toughened epoxy resin that can be cured from 275ºF (135ºC) to 350ºF (177ºC), depending on service temperature requirements. HexPly® M76 is formulated for lower temperature autoclave or press mold processing. The recommended lay-up procedure for HexPly® M76 is HSP-L4. The recommended cure procedures are HSP-C5 (275ºF) or HSP-C1 (350ºF). Typical applications for HexPly® M76 include aircraft primary and secondary structures, space structure, and any application where impact resistance and lightweight as well as versatile cure conditions are required. Features: - Toughened epoxy exhibiting “co-continuous” morphology
- Excellent impact resistance
- Versatile cure temp; 275ºF (135ºC) to 350ºF (177ºC)
- Controlled flow
- Available in a broad range of reinforcements for both tapes and fabrics
- Autoclave or press mold processing
- Low outgassing
Information provided by Hexcel Corporation. |