| NanoTach® is a thick paste of nano-sized silver powder in an organic binder that can be used as an alternative to solder or epoxy in semiconductor devices in the state-of-the-art individual packages or multi-chip power modules. NBE’s lead-free nanomaterial attachment possesses better thermal, mechanical and electrical properties than soldered or epoxied alternatives. The attachment process is completely compatible with existing equipment and facilities that use solders or epoxies. Using NBE’s material and process, high power-density semiconductor electronic or optoelectronic devices can be operated at high temperatures in excess of 250° C, not attainable with any existing solder-based or epoxy-based materials. Specific applications can include bonding to large chips for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, and RF power devices. Compared to the current die-attach materials, nanoTach® offers: - 5x higher thermal and electrical properties
- > 250° C capability
- < 275° C ambient or low pressure (5 MPa) processing
- Improved reliability from low elastic modulus
- One-to-one RoHS compliant replacements.
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